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PC

PC

Overview

High strength, impact resistance, and high heat deflection. Used in engineering applications.

PC Has a minor flexibility property and can be lightly bent without breaking. It has outstanding thermal properties, being flame retardant and having very high heat resistance.

PC requires high extruder and bed temperatures. An enclosure is needed to keep the material warm while printing.  Prints can warp, and layers may not bond together if the temperature is too low or if cooling is enabled. It is hygroscopic, meaning it easily absorbs moisture from the air – spools should always be stored in dry air-tight places.

Used for: Car Parts, Electronic Casings, 3D Printer Parts.

Strength

Very High

Durability

Very High

Printability

Difficult

Pros

Cons

Recommended Settings

Print Temp

260°C -310°C

Cooling Fan Off

Temp may vary on brand

Bed Temp

70°C - 90°C

Temp may vary on brand

Print Surface

Heated Bed Required
Enclosure Required

Example Prints